SUSS MicroTec Launches XBS200 - A New Automated Permanent Wafer Bonding System
GARCHING, DE / ACCESSWIRE / March 13, 2017 / SUSS MicroTec (XETRA: SMHN), a leading supplier of equipment and process solutions for the semiconductor industry and related markets, launched a brand-new automated permanent wafer bonding system today. The XBS200 is a universal platform, designed for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding...
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