Antenna-in-Package (AiP) Technology Market to Reach US$ 327.3 Mn by 2031 | Transparency Market Research Inc.

WILMINGTON, DE / ACCESSWIRE / April 18, 2023 / Transparency Market Research Inc. - The surge in adoption of antenna-in-package (AiP) technology by chipmakers can be ascribed to a rise in demand for high-frequency automotive radars, imaging sensors, wireless links, and phased arrays.

Recent market trends underscore a steady demand for packaging technology to improve signal integrity in a multitude of millimeter wave (mmWave) applications. The Global Antenna-in-Package (AiP) Technology Market stood at US$ 34.8 Mn in 2022 and is projected to advance at a CAGR of 28.3% from 2023 to 2031 and reach US$ 327.3 Mn by the end of 2031.

The rise in the utilization of AiP technology for highly-integrated wireless devices is expected to propel market growth. Additionally, AiP technology is gaining traction to develop Internet of Things (IoT) wireless nodes. Companies are unveiling chips in AiP modules to cater to the rise in demand for high-performance radar units in the defense & aerospace industry. An instance is the launch of a 77 GHz beamforming chip in the AiP module for use in high-resolution 4D imaging radars, which find usage in commercial and defense applications.

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Key Findings of Study

• A Surge in Usage of AiP Technology for Radar Applications: An increase in the trend of incorporating high-end radars in autonomous vehicles is likely to offer significant opportunities for companies in the market. Rise in usage of high-performance automotive radars is likely to bolster adoption of AiP technology.
• An example is the usage of AiP automotive 77GHz radar systems, which are likely to meet the latest safety and security standards in electrical and electronic systems used in vehicles. Among the various applications in the market, the automotive radars segment is estimated to account for the leading share from 2023 to 2031.
• Rapid pace of adoption of connected vehicles is likely to fuel the automotive radars segment. The surge in adoption of AiP technology for chips used in IoT applications is likely to propel the antenna-in-package (AiP) technology market.
• Rise in Adoption of Flip Chip Ball Grid Array (FCBGA): Among the various packaging technologies used, flip chip ball grid array (FCBGA) is anticipated to be lucrative technology during the forecast period.
• High preference for FCBGA is ascribed to several advantages, such as design flexibility and high electrical performance of the final chip. Rapid increase in commercialization of FCBGA packages and rise in R&D in the design and assembly of these packages are estimated to bolster the antenna-in-package (AiP) technology market value in the near future.

Key Drivers

• Rapid pace of penetration of 5G network services in several countries is expected to drive the antenna-in-package (AiP) technology market. Surge in demand for 5G smartphones is likely to accelerate market development. Rise in usage of mobile devices is expected to bolster the market.
• Emerging wireless communication standards are anticipated to bolster market growth. Rise in number of millimeter wave (mmWave) applications in telecommunications, including low-power IoT devices, high-bandwidth WLANs, and point-to-point wireless local area networks is likely to offer lucrative opportunities to companies in the market.

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Regional Growth Dynamics

• The market in North America is anticipated to expand at a significant pace from 2023 to 2031. Extensive R&D in antenna-in-package (AiP) technology in the U.S. is likely to propel the market in the region.
• Asia Pacific is estimated to account for the leading market share during the forecast period. Surge in demand for miniaturized electronic devices is expected to drive the market.
• Rise in the usage of AiP technology in wireless communication systems and radars is anticipated to fuel market growth. AiP technology is widely preferred for the manufacture of integrated & miniaturized RF components.

Competition Landscape:

The market landscape is fragmented, with the presence of numerous well-entrenched players who account for the majority share. Prominent players are focusing on product portfolio expansions, mergers, and acquisitions in order to increase market share.

Key companies in the antenna-in-package (AiP) technology market are

• 3D Glass Solutions,
• Advanced Semiconductor Engineering Inc.,
• Amkor Technology Inc.,
• MediaTeck Inc.,
• MixComm Inc.,
• Murata Manufacturing Co., Ltd.,
• Powertech Technology Inc.,
• Samsung Electronics Co., Ltd.,
• Texas Instruments Incorporated, and TMY Technology Inc.

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Antenna-in-Package (AiP) Technology Market Segmentation

By Packaging Technology

• Flip Chip Ball Grid Array (FCBGA)
• Low-density Fan-out Package
• High-density Fan-out Package
• Others (3D Stacking, 2.5D Stacking, etc.)

By Frequency

• Up to 50 GHz
• 51-100 GHz
• 101-200 GHz
• 201 to 300 GHz
• Above 300 GHz

By Application

• Radios and Gesture Radars
• Automotive Radars
• Wireless links
• Smart Cameras
• Wearable Devices
• Others (Robotics, Imaging Sensors, etc.)
• 5G Devices/Mobile Networks

By End-use Industry

• Aerospace & Defense
• Automotive
• Consumer Electronics
• IT & Telecommunication
• Industrial
• Others (Healthcare, Research & Academia, etc.)

Regions Covered

• North America
• Europe
• Asia Pacific
• South America
• Middle East & Africa

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